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Configured for high-speed sequence control in FA-M3 PLC platforms, the YOKOGAWA F3SP76-7S (F3SP76-7S Sequence CPU Module) provides direct physical and electrical execution of logic instructions and I/O management.
| Parameter | Specification |
|---|---|
| Model | F3SP76-7S |
| Brand | YOKOGAWA |
| Origin | Japan |
| Weight | 0.32kg |
| Dimensions | 28.9 mm x 100 mm x 83.2 mm |
| Operating Temp | 0 deg C to 55 deg C (Standard industrial rating) |
| Power Consumption | 1.0 A (5 VDC internal bus supply) |
| Program Capacity | 260K ladder steps |
| Instruction Speed | 0.00375 us/step (Basic) |
| Max I/O Points | 8192 points |
The F3SP76-7S utilizes a high-velocity backplane bus to maintain deterministic scan cycles across distributed I/O architectures. It supports firmware flash compatibility for system updates and provides I/O density scaling capabilities to accommodate expanding automation requirements. The architecture is designed to handle multi-tasking operations, ensuring consistent execution timing for time-critical logic, while managing communication loads via integrated Ethernet connectivity to ensure network-wide data coherence.
Q: Does the F3SP76-7S support online firmware updates?
A: The module supports firmware updates via the dedicated programming interface; however, the CPU must be placed in a Stop state to verify integrity and prevent corruption of the runtime control logic.
Q: Is this CPU module compatible with hot-swap operations on the FA-M3 backplane?
A: No, the module requires the power to be disconnected from the base unit prior to insertion or removal to prevent electrical arcing on the backplane pins and to ensure hardware safety.