Configured for high-speed logic execution in FA-M3 control networks, the Yokogawa F3SP58-6S (F3SP58-6S Sequence CPU Module) provides direct physical/electrical execution of deterministic sequence control and data processing.
Configured for high-speed logic execution in FA-M3 control networks, the Yokogawa F3SP58-6S (F3SP58-6S Sequence CPU Module) provides direct physical/electrical execution of deterministic sequence control and data processing.
Hardware Specifications
Parameter
Specification
Model
F3SP58-6S
Brand
Yokogawa
Origin
japan
Weight
0.21 kg
Dimensions
28.9 mm x 100 mm x 113.2 mm
Operating Temp
0 deg C to 55 deg C
Power Consumption
890 mA at 5 VDC
Module Type
Sequence CPU Module
Series
FA-M3
Process Control and Backplane Bus Communication
The F3SP58-6S module functions as the central processing unit for the FA-M3 platform, managing backplane bus communication velocity and I/O coordination. The architecture is engineered to provide deterministic network response times, facilitating high-speed sequence control across expanded I/O rack configurations. The module includes robust internal diagnostics to monitor processor health and bus integrity, ensuring that firmware flash compatibility and real-time task scheduling are maintained during active operation in demanding industrial environments.
Frequently Asked Questions
Q: Does the F3SP58-6S support hot-swapping while the base unit is energized?
A: No. The F3SP58-6S does not support hot-swapping. The power supply to the base unit must be disconnected before the CPU module is installed or removed to prevent electrical surges on the backplane.
Q: Is the F3SP58-6S compatible with standard FA-M3 I/O modules?
A: Yes, the F3SP58-6S is designed for full compatibility with the FA-M3 series I/O portfolio; however, verify the specific base unit power capacity to ensure the 890 mA load is within the operational limits of the installed power supply module.
Field Installation Guidelines
Verify that the operating environment is free of corrosive gases, flammable vapors, and heavy dust to prevent degradation of the module's electronic components.
Ensure the module is properly aligned and fully seated in the CPU slot of the FA-M3 base unit to maintain secure contact with the backplane bus.
Tighten the module retaining screws to ensure proper grounding and to prevent loosening due to machine vibration.
Route communication cables away from high-current power sources to mitigate potential electromagnetic interference that could affect the processor's clock signal.
Post-installation, confirm the module status indicators show nominal operation after power-up before attempting to download the sequence program to the CPU.
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