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Configured for high-density discrete signal acquisition in FA-M3 control networks, the Yokogawa F3XD64-3F/K2 (F3XD64-3F/K2 Digital Input Module) provides direct electrical execution for 64-channel field device interfacing via the system backplane.
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Configured for high-density discrete signal acquisition in FA-M3 control networks, the Yokogawa F3XD64-3F/K2 (F3XD64-3F/K2 Digital Input Module) provides direct electrical execution for 64-channel field device interfacing via the system backplane.
The F3XD64-3F/K2 represents the high-density digital input configuration within the FA-M3 series. The suffix "/K2" designates specific terminal block and interface compatibility standards, ensuring physical and electrical alignment with the standard FA-M3 modular rack systems.
| Parameter | Specification |
|---|---|
| Model | F3XD64-3F/K2 |
| Brand | Yokogawa |
| Origin | Japan |
| Weight | 0.14 kg |
| Dimensions | Standard FA-M3 single-slot form factor |
| Operating Temp | 0 to 55 deg C |
| Power Consumption | 75 mA (5 V DC) |
| Input Channels | 64 |
| Rated Input Voltage | 24 V DC |
| Input Response Time | 0, 62.5, 250, 1000, 16000 us (Selectable) |
The F3XD64-3F/K2 is engineered for seamless integration into Yokogawa DCS and PLC environments, providing essential signal conditioning for process control loops. The module architecture incorporates photocoupler-based channel-to-channel isolation to maintain signal integrity and suppress electrical noise when interfaced with remote field instrumentation. By adhering to standardized input voltage thresholds (16.0 V DC for ON state), the module ensures deterministic data acquisition across all 64 channels, suitable for high-speed process monitoring and sequence control.
Q: Does this module support both sink and source input configurations?
A: Yes. The F3XD64-3F/K2 is designed to accommodate both sink and source input wiring, allowing it to adapt to various field device signal polarities without hardware modification.
Q: Is this module capable of hot-swapping?
A: No. Standard FA-M3 modules are not designed for hot-swapping. The power to the rack must be removed before installing or removing the module to prevent electrical arcing or damage to the backplane communication pins.
