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The Woodward 5466-419, also cataloged as the 5466-419 CPU Processor Module, operates as a dedicated hardware component for microprocessor-based control execution and real-time system monitoring within MicroNet Plus control platforms. Driven by an onboard Intel Atom processor paired with 2 GB DDR3 RAM and 8 GB eMMC flash memory, the module executes high-speed control algorithm loops and systemic diagnostic tasks across the backplane chassis using a 24 VDC power supply.
| Parameter | Specification |
|---|---|
| Model | 5466-419 |
| Brand | Woodward |
| Origin | USA |
| Weight | 1.25 kg |
| Dimensions | 120 x 80 x 35 mm |
| Operating Temp | -40 deg C to +85 deg C |
| Power Consumption | Standard 24 VDC System Power |
| Product Type | CPU Processor Module |
| Processor Type | Intel Atom Processor |
| System Memory | 2 GB DDR3 RAM |
| Non-Volatile Storage | 8 GB eMMC Flash Memory |
| Operating Voltage | 24 VDC |
| Platform Compatibility | Woodward MicroNet Plus |
The CPU module coordinates real-time deterministic tasks to ensure ultra-low latency in actuator loop feedback response routines. By processing critical control matrices directly through the Intel Atom engine and high-bandwidth DDR3 RAM, the module executes task loops with sub-millisecond execution times. This processing capacity minimizes phase delay across high-speed governor and turbine valve control loops, ensuring precise actuator positioning and immediate transient recovery under dynamic load changes.
Q: How does the integrated 8 GB eMMC flash memory handle onboard data logging and firmware storage?
A: The non-volatile 8 GB eMMC flash memory stores the main control operating system, application logic files, system fault logs, and historical trend data without requiring continuous battery power.
Q: Can this CPU module be replaced or swapped without powering down peripheral field I/O devices?
A: Module replacement must be performed in accordance with MicroNet Plus backplane power protocols; while peripheral field loops remain powered by external 24 VDC field supplies, powering down or bypassing the active control rack is required before removing or reseating the main CPU card.
Q: What mechanisms ensure stable CPU operation in high-temperature industrial environments?
A: The module is engineered with industrial-grade silicon components rated across an extended operating range of -40 deg C to +85 deg C, utilizing passive conduction heat sinking to dissipate thermal energy within standard MicroNet chassis airflow profiles.