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F3SP76-7S Sequence CPU Module YOKOGAWA

F3SP76-7S Sequence CPU Module YOKOGAWA

Configured for high-speed sequence control in FA-M3 PLC platforms, the YOKOGAWA F3SP76-7S (F3SP76-7S Sequence CPU Module) provides direct physical and electrical execution of logic instructions and I/O management.

Hardware Specifications

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AvailabilityIn stock

SKU: F3SP76-7S
Vendor: Yokogawa
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Configured for high-speed sequence control in FA-M3 PLC platforms, the YOKOGAWA F3SP76-7S (F3SP76-7S Sequence CPU Module) provides direct physical and electrical execution of logic instructions and I/O management.

Hardware Specifications

Parameter Specification
Model F3SP76-7S
Brand YOKOGAWA
Origin Japan
Weight 0.32kg
Dimensions 28.9 mm x 100 mm x 83.2 mm
Operating Temp 0 deg C to 55 deg C (Standard industrial rating)
Power Consumption 1.0 A (5 VDC internal bus supply)
Program Capacity 260K ladder steps
Instruction Speed 0.00375 us/step (Basic)
Max I/O Points 8192 points

PLC Control and Deterministic Network Processing

The F3SP76-7S utilizes a high-velocity backplane bus to maintain deterministic scan cycles across distributed I/O architectures. It supports firmware flash compatibility for system updates and provides I/O density scaling capabilities to accommodate expanding automation requirements. The architecture is designed to handle multi-tasking operations, ensuring consistent execution timing for time-critical logic, while managing communication loads via integrated Ethernet connectivity to ensure network-wide data coherence.

Frequently Asked Questions

Q: Does the F3SP76-7S support online firmware updates?

A: The module supports firmware updates via the dedicated programming interface; however, the CPU must be placed in a Stop state to verify integrity and prevent corruption of the runtime control logic.

Q: Is this CPU module compatible with hot-swap operations on the FA-M3 backplane?

A: No, the module requires the power to be disconnected from the base unit prior to insertion or removal to prevent electrical arcing on the backplane pins and to ensure hardware safety.

Field Installation Guidelines

  • Verify the mounting integrity on the FA-M3 base unit to ensure all backplane connectors are fully seated and engaged.
  • Ensure the module is installed in an environment free of conductive dust and corrosive gases to protect internal logic circuitry.
  • Ground the base unit chassis to a dedicated earth bus to prevent potential common-mode noise interference with the internal communication bus.
  • Keep communication cables separated from high-voltage power lines to maintain signal signal-to-noise ratios during high-speed data transmission.