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GE Fanuc Emerson IC200MDL940 Relay Output Module

GE Fanuc Emerson IC200MDL940 Relay Output Module

Configured for deterministic process and discrete control execution within VersaMax I/O platforms, the GE Fanuc Emerson IC200MDL940 (IC200MDL940 Relay Output Module) provides direct physical/electrical execution.

Hardware Specifications

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AvailabilityLow stock: 50 left

SKU: IC200MDL940
Vendor: Yokogawa
Related Series:

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Configured for deterministic process and discrete control execution within VersaMax I/O platforms, the GE Fanuc Emerson IC200MDL940 (IC200MDL940 Relay Output Module) provides direct physical/electrical execution.

Hardware Specifications

Parameter Specification
Model IC200MDL940
Brand GE Fanuc Emerson
Origin Standard Industrial Specification
Weight 0.51 kg (1.13 lbs)
Dimensions Standard Modular Enclosure
Operating Temp 0 deg C to 60 deg C
Power Consumption Standard Backplane Power
Output Channels 16 points, individually isolated
Output Contact Form Normally Open (Form A)
Contact Rating 2.0 Amperes (0 to 125 VDC / 0 to 265 VAC)

Profinet / EtherNet/IP Deterministic Networks and I/O Density

The hardware configuration maintains strict individual channel isolation across all 16 Form A relay outputs to suppress common-mode transient voltage spikes and eliminate ground loop interference between field actuators. Integration with high-density backplane bus communication architectures and deterministic industrial network protocols ensures rapid state propagation, low-latency command execution, and transparent diagnostic feedback across distributed control nodes.

Frequently Asked Questions

Q: What are the restrictions regarding maximum current load limits across the relay output channels?

A: Each individual output channel must operate within the specified maximum contact rating of 2.0 Amperes to prevent thermal degradation or contact welding under continuous load.

Q: How does the module interface with backplane bus communication and power distribution?

A: The module mounts onto a standard VersaMax carrier base, drawing internal logic power directly from the backplane while routing field-side power through dedicated terminal connections.

Field Installation Guidelines

Mount the module securely onto its designated VersaMax carrier base, ensuring proper physical alignment with backplane pins before locking the unit into place. Route heavy-load AC/DC switching lines away from sensitive low-voltage analog or communication cables, and use shielded twisted-pair wiring where applicable. Terminate cable shielding and ground drain wires securely to the designated cabinet earth grounding bar.