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MX150 Base Assembly Board YOKOGAWA

MX150 Base Assembly Board YOKOGAWA

The YOKOGAWA MX150 Base Assembly Board, also cataloged as the MX150 Base Module, operates as a dedicated hardware component for interconnectivity and physical chassis mounting within data acquisition system platforms.

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Availability: Low stock: 50 left

SKU: MX150
Vendor: Yokogawa
Category: Base Assembly Board
Related Series:

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The YOKOGAWA MX150 Base Assembly Board, also cataloged as the MX150 Base Module, operates as a dedicated hardware component for interconnectivity and physical chassis mounting within data acquisition system platforms.

Hardware Specifications

Parameter Specification
Model MX150
Brand YOKOGAWA
Origin Japan
Weight 0.2 kg
Dimensions 178 mm x 38 mm x 83 mm
Operating Temp Not specified
Power Consumption Not specified
Function System base mounting

Industrial Control Connectivity

The MX150 serves as the structural and electrical foundation for the MX100 series data acquisition modules. It provides the necessary backplane bus communication velocity and mechanical support required for deterministic signal polling. The assembly facilitates I/O density scaling, allowing multiple modules to be interconnected while maintaining signal integrity for analog and digital inputs transmitted via the internal backplane architecture.

Frequently Asked Questions (FAQ)

Q: What is the maximum number of modules that can be linked on a single MX150 base assembly?

A: The capacity is determined by the system configuration and the total backplane bus load. Consult the system integration manual to ensure power supply and communication bandwidth limits are not exceeded during expansion.

Q: How is the MX150 secured within the equipment cabinet?

A: The base assembly is designed for standard industrial panel mounting. Ensure the mounting surface is flat and vibration-free to maintain firm contact between the module connectors and the backplane bus.

Field Installation Guidelines

  • Mounting: Position the MX150 base on a stable, grounded metallic panel. Use the designated mounting holes to secure the assembly, ensuring the board remains level to prevent mechanical stress on the connector interfaces.
  • Module Insertion: Align the data acquisition modules with the base slots before engaging the backplane connector. Apply even pressure until the locking mechanism secures the module in place.
  • Shielding: Bond the base assembly chassis to the facility earth ground to provide a low-impedance path for noise mitigation. Proper grounding is necessary to protect the backplane bus from external electromagnetic interference.
  • Wiring: Manage input/output wiring using cable trays to avoid placing excessive mechanical load on the base assembly terminals. Ensure all cables are secured to prevent intermittent contact due to thermal expansion or cabinet vibration.